Printed wiring board and method for manufacturing the same
US8686300B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 27, 2009 |
| Grant date | Apr 1, 2014 |
| Priority date | — |
| Expiry date | May 7, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed wiring board includes a resin insulation layer having a first surface and a second surface on an opposite side of the first surface, the resin insulation layer having an opening for a first via conductor, a pad formed on the first surface of the resin insulation layer and provided to mount an electronic component, a first conductive circuit formed on the second surface of the resin insulation layer, and a first via conductor formed in the opening and connecting the pad and the first conductive circuit. The pad has an embedded portion embedded in the resin insulation layer and a protruding portion protruding from the resin insulation layer, and the embedded portion has an external shape which is greater than an external shape the protruding portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.