Substrate, substrate holding apparatus, analysis apparatus, program, detection system, semiconductor device, display apparatus, and semiconductor manufacturing apparatus
US8686743B2 · kind B2 · utility
0Cited by
7References
14Claims
0Family size
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Key dates
| Filing date | Nov 19, 2009 |
| Grant date | Apr 1, 2014 |
| Priority date | — |
| Expiry date | May 4, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/32935
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A substrate including a sensor unit, wherein the sensor unit includes a coil wound at least once arranged on the surface of the sensor or embedded within and near the surface thereof. With such an arrangement, an electric current that corresponds to information with respect to the substrate (e.g., the temperature of the substrate or the amount of charge stored in the substrate) flows through the coil.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.