Pattern shaping of RF emission patterns
US8686905B2 · kind B2 · utility
114Cited by
207References
11Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 31, 2012 |
| Grant date | Apr 1, 2014 |
| Priority date | — |
| Expiry date | Dec 31, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01Q21/26
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A metallic shaping plate located in the interior housing of a wireless device is disclosed. The metallic shaping plate may influence a radiation pattern being generated by a horizontal antenna array. The result may be an increase in the gain of the array.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.