Patent · US Active

Method of manufacturing a resonating structure

US8689426B2 · kind B2 · utility

13Cited by

57References

22Claims

0Family size

Assignee

Sand 9, Inc. · US

Inventors

Florian Thalmayr · Unterhaching, DE
Jan H. Kuypers · Cambridge, US
Klaus Juergen Schoepf · Chandler, US

Key dates

Filing date	Jul 19, 2011
Grant date	Apr 8, 2014
Priority date	—
Expiry date	Mar 18, 2032

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/4908
WIPO fieldBasic communication processes
WIPO sectorElectrical engineering

Abstract

Aspects of the subject disclosure include, for example, obtaining a mechanical resonating structure comprising a compensating structure, where the compensating structure comprises one or more materials having an adaptive stiffness that reduces a variance in a resonating frequency of the mechanical resonating structure (f0), and adjusting at least one of a value of f0 of the obtained mechanical resonating structure or a value of a temperature for which temperature coefficient of frequency of the obtained mechanical resonating structure is approximately zero (T0) by altering a thickness of at least one targetable material of the mechanical resonating structure. Other embodiments are disclosed.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.