Method of reworking head suspension
US8689429B2 · kind B2 · utility
1Cited by
3References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 26, 2010 |
| Grant date | Apr 8, 2014 |
| Priority date | — |
| Expiry date | Jun 25, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T83/9295
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of reworking a head suspension removes a slider from the head suspension by pressing a blade from a first side toward a second side in a longitudinal direction of the slider to solder ball bonding, stopping the second side of the slider in the longitudinal direction with a holding mechanism, and forcing the blade to bite and cut the solder ball bonding to remove the slider from the flexure. The solder ball bonding is cut without applying extra force to components of the head suspension except the slider. The method improves product yield.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.