Patent · US Active

Bonding assembly

US8689516B2 · kind B2 · utility

6Cited by

85References

19Claims

0Family size

Assignee

Zephyros, Inc. · US

Inventors

Henry E. Richardson · Idlewild, US
Jeffery Thomas Shantz · Metamora, US
Alex Mangiapane · Macomb Township, US

Key dates

Filing date	Mar 19, 2012
Grant date	Apr 8, 2014
Priority date	—
Expiry date	Mar 19, 2032

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T403/472
WIPO fieldTransport
WIPO sectorMechanical engineering

Abstract

A device and method for the protection of a first member and second member from corrosion by utilizing a connector that bonds the members without allowing direct contact of the members.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.