Component configured for being subjected to high thermal load during operation
US8689540B2 · kind B2 · utility
1Cited by
6References
29Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 13, 2007 |
| Grant date | Apr 8, 2014 |
| Priority date | — |
| Expiry date | Dec 20, 2029 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF05D2260/232
- WIPO fieldEngines, pumps, turbines
- WIPO sectorMechanical engineering
Abstract
A component configured for being subjected to a high thermal load during operation includes a wall structure with cooling channels adapted for handling a coolant flow. At least one first cooling channel is adapted to convey the coolant from a first portion of the component to a second portion of the component. At least one second cooling channel in the second portion is closed so that the coolant is at least substantially-prevented from entering the closed second cooling channel from a cooling channel in the first portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.