Deposition apparatus, and deposition method
US8691016B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 29, 2010 |
| Grant date | Apr 8, 2014 |
| Priority date | — |
| Expiry date | Oct 29, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K71/60
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A deposition mask 601 is used to form a thin film 3 in a prescribed pattern on a substrate 10 by deposition. Each of a plurality of improved openings 62A of the deposition mask 601 has a protruding opening portion 64, and is formed so that the opening amount at an end in a lateral direction is larger than that in a central portion in the lateral direction. In a deposition apparatus 50, the deposition mask 601 is held in a fixed relative positional relation with a deposition source 53 by a mask unit 55. In the case of forming the thin film 3 in a stripe pattern on the substrate 10 by the deposition apparatus 50, deposition particles are sequentially deposited on the substrate 10 while relatively moving the substrate 10 along a scanning direction with a gap H being provided between the substrate 10 and the deposition mask 601.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.