Method for manufacturing ejection element substrate
US8691101B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 26, 2011 |
| Grant date | Apr 8, 2014 |
| Priority date | — |
| Expiry date | Jan 25, 2032 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2002/14403
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A method for manufacturing an ejection element substrate, which is provided with a flow-channel-forming member having an ejection orifice for ejecting a liquid and a liquid flow channel that is communicated with the ejection orifice, a substrate having a supply port for supplying the liquid to the liquid flow channel, and a filter structure formed in the bottom of the supply port, includes: forming the supply port by forming a through-hole by etching the substrate from a second face of the substrate on the side opposite to a first face of the substrate, on which the flow-channel-forming member is disposed; providing a resinous protection film on the side face and the bottom of the supply port; and forming a minute opening in the resinous protection film in the bottom of the supply port by carrying out a laser processing from the side of the second face.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.