Patent · US Active

Material for packaging electronic components

US8691375B2 · kind B2 · utility

0Cited by

3References

10Claims

0Family size

Assignee

3M INNOVATIVE PROPERTIES COMPANY · US

Inventors

Anton Kuepper · Kaarst, DE
Christian Weinmann · Neuss, DE

Key dates

Filing date	Apr 1, 2010
Grant date	Apr 8, 2014
Priority date	—
Expiry date	Jun 3, 2030

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T428/249987
WIPO fieldElectrical machinery, apparatus, energy
WIPO sectorElectrical engineering

Abstract

The invention provides a material for packaging of electronic components comprising a structured layer, wherein said structured layer comprises a mesh of cells, each cell comprising an electrically conductive rim and an electrically non conductive interior, said cells being interconnected so that any two adjacent cells share at least a portion of their respective rims.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.