Cutting tool

US8691378B2 · kind B2 · utility

Assignee

• WALTER AG · DE

Inventors

• Veit Schier · Echterdingen, DE
• Oliver Eibl · Munich, DE
• Wolfgang Engelhart · Metzingen, DE

Key dates

• Filing date: Mar 18, 2010
• Grant date: Apr 8, 2014
• Expiry date: Aug 5, 2030

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T428/265
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

The invention relates to a cutting tool having a substrate base body and a single or multi-layered coating attached thereupon, wherein at least one layer of the coating is a metal oxide layer produced in the PVD process or in the CVD process and the metal oxide layer has a grain structure wherein there is structural disorder within a plurality of the existing grains that are characterized in that in electron diffraction images of the grains, point-shaped reflections occur up to a maximum lattice spacing dGRENZ and for lattice spacing greater than dGRENZ no point-shaped reflections occur, but rather a diffuse intensity distribution typical for amorphous structures.