Thiol bond formation concurrent with silver nanoparticle ink thermal treatment
US8691621B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 20, 2012 |
| Grant date | Apr 8, 2014 |
| Priority date | — |
| Expiry date | Nov 20, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K71/611
Abstract
A method is provided for preparing a printed metal surface for the deposition of an organic semiconductor material. The method provides a substrate with a top surface, and a metal layer is formed overlying the substrate top surface. Simultaneous with a thermal treatment of the metal layer, the metal layer is exposed to a gaseous atmosphere with thiol molecules. In response to exposing the metal layer to the gaseous atmosphere with thiol molecules, the work function of the metal layer is increased. Subsequent to the thermal treatment, an organic semiconductor material is deposited overlying the metal layer. In one aspect, the metal layer is exposed to the gaseous atmosphere with thiol molecules by evaporating a liquid containing thiol molecules in an ambient air atmosphere. Alternatively, a delivery gas is passed through a liquid containing thiol molecules. An organic thin-film transistor (OTFT) and OTFT fabrication process are also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.