Method and apparatus for depositing a pattern on a substrate
US8691667B1 · kind B1 · utility
0Cited by
9References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 29, 2005 |
| Grant date | Apr 8, 2014 |
| Priority date | — |
| Expiry date | Nov 2, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K71/12
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
This invention relates to a process for forming a continuous pattern on a substrate with a liquid media. Upon the deposition of the liquid media on the substrate, a portion the continuous pattern is evaporated upon contact with the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.