Heat curable adhesive composition
US8691909B2 · kind B2 · utility
7Cited by
1References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 20, 2010 |
| Grant date | Apr 8, 2014 |
| Priority date | — |
| Expiry date | Nov 21, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2887
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
1) Heat-curable adhesive composition comprising: in which: 2) Self-adhesive support coated with the cured adhesive composition.3) Use for the manufacture of self-adhesive labels and/or tapes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.