Method of material processing with laser pulses having a large spectral bandwidth and apparatus for carrying out said method

US8692155B2 · kind B2 · utility

Assignee

• Carl Zeiss Meditec AG · DE

Inventors

• Mark Bischoff · Jena, DE
• Martin Hacker · Jena, DE
• Roland Sauerbrey · Dresden, DE
• Gregor Stobrawa · Jena, DE
• Wolfgang Ziegler · Waldbronn, DE

Key dates

• Filing date: Aug 1, 2011
• Grant date: Apr 8, 2014
• Expiry date: Nov 20, 2031

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B23K26/064
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

A method and device for processing materials with laser pulses having a large spectral bandwidth and a device for carrying out said method. The aim of the invention is to create an easy, flexible method enabling universally applicable processing which can, however, be adapted to specific processing and methodological requirements. According to the invention, one or several spectral parameters of the laser pulses, i.e. the spectral amplitude and/or spectral phase and/or spectral polarization thereof, is/are specifically modified, preferably according to a measuring process variable, in order to process material or during the occurrence of said processing. The invention is used in order to process material with laser pulses having a large spectral bandwidth, particularly femto-second pulses and pico-second pulses.