Light emitting diode package structure
US8692274B2 · kind B2 · utility
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2References
2Claims
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Assignee
Inventors
Key dates
| Filing date | Apr 17, 2012 |
| Grant date | Apr 8, 2014 |
| Priority date | — |
| Expiry date | Apr 17, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8582
Abstract
A light-emitting diode (LED) package structure including a carrier substrate, at least one LED chip, an optical element and a thermal-conductive transparent liquid is provided. The LED chip is disposed on the carrier substrate and has an active layer. The optical element is disposed on the substrate and forms a sealed space with the carrier substrate, and the LED chip is disposed in the sealed space. The thermal-conductive transparent liquid fills up the sealed space.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.