Embedded ball grid array substrate and manufacturing method thereof
US8692391B2 · kind B2 · utility
6Cited by
12References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 17, 2010 |
| Grant date | Apr 8, 2014 |
| Priority date | — |
| Expiry date | Dec 17, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed herein are an embedded ball grid array substrate and a manufacturing method thereof. The embedded ball grid array includes: a core layer having a cavity therein; a semiconductor device embedded in the cavity of the core layer; a first circuit layer having a circuit pattern including a wire bonding pad formed thereon; a second circuit layer having a circuit pattern including a solder ball pattern formed thereon; and a wire electrically connecting the semiconductor device to the wire bonding pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.