System and method for use in determining the thickness of a layer of interest in a multi-layer structure
US8692564B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 4, 2011 |
| Grant date | Apr 8, 2014 |
| Priority date | — |
| Expiry date | Mar 26, 2032 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01B7/105
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method for use in determining the thickness of a layer of interest in a multi-layer structure. A first electrode is positioned in contact with a first surface of the multi-layer structure, and a second electrode is positioned in contact with a second surface of the multi-layer structure. The second surface is substantially opposite the first surface. The first electrode is pressed against the multi-layer structure at a predetermined sampling pressure, and the structure is optionally adjusted to a predetermined sampling temperature. The electrical impedance between the first electrode and the second electrode is measured.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.