Flexible force or pressure sensor array using semiconductor strain gauge, fabrication method thereof and measurement method thereof
US8695441B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 18, 2011 |
| Grant date | Apr 15, 2014 |
| Priority date | — |
| Expiry date | Jul 26, 2032 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01L1/2293
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The force or pressure sensor array of the present invention effectively has both flexibility and elasticity. Since the substrate itself is a kind of a polymer material, the substrate can be bent or expanded. Although silicon, which is a material of the semiconductor strain gauge, is easily broken and solid, mechanical flexibility can be secured if it is fabricated extremely thin. To this end, particularly, disclosed is a flexible force or pressure sensor array using semiconductor strain gauges 110, the sensor array comprising: a substrate 10 including: the semiconductor strain gauges 110 in which a plurality of elements formed in a certain array pattern is deformed by force or pressure, a pair of polymer film layers 120 and 130 having film surfaces contacted facing each other and containing the semiconductor strain gauge 110 between the film surfaces contacted with each other, and a pair of signal line layers formed on top and bottom surfaces of an insulating layer using either of the pair of polymer film layers 120 and 130 as the insulating layer and connected to the elements 111 of the array pattern to form electrodes, for fetching deformation signals outputted due to deformation…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.