Wafer flattening apparatus and method
US8695990B2 · kind B2 · utility
2Cited by
3References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 1, 2011 |
| Grant date | Apr 15, 2014 |
| Priority date | — |
| Expiry date | May 29, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T279/11
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus and method for securing a substantially circular wafer uses a chuck having a plurality of tensioning grooves each having at least one arcuate bend having a bend radius substantially less than an outer region radius, and a vacuum source interconnected with each of the grooves. When the wafer is placed upon the surface concentric with the chuck center and the vacuum source applied to the grooves, the wafer is held securely to the surface without distortion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.