Bonding of silicone gaskets and systems containing bonded silicone gaskets
US8696859B2 · kind B2 · utility
0Cited by
8References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 12, 2007 |
| Grant date | Apr 15, 2014 |
| Priority date | — |
| Expiry date | Nov 24, 2030 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J2483/008
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A method of bonding an electrically conductive silicone gasket includes activating selected surfaces of the electrically conductive silicone gasket, applying a sealant having a corrosion inhibitor to at least a portion of the activated selected surfaces, and curing the sealant to thereby bond the electrically conductive silicone gasket with a substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.