Method for forming a protective coating with enhanced adhesion between layers
US8697195B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 30, 2006 |
| Grant date | Apr 15, 2014 |
| Priority date | — |
| Expiry date | Sep 4, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12472
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method for forming a protective coating on a substrate comprising, applying a bond coating to the substrate, the bond coating having a first surface roughness, ionizing an inert gas which flows into the surface of the bond coating so as to impart a second surface roughness to the bond coating greater than the first surface roughness, wherein the inert gas is ionized and caused to flow into the surface of the bond coating by a reverse polarity current supplied to an electrode which removes at least one electron from the inert gas, and applying a top coating to the bond coating. Additionally, a method for preparing a surface to receive and adhere to a coating comprising roughening the surface to create a micro-roughening network on the surface. In addition, a method of improving strain tolerance and cyclic spallation life of a protective coating.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.