Fine line bonding and/or sealing system and method
US8697236B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 6, 2006 |
| Grant date | Apr 15, 2014 |
| Priority date | — |
| Expiry date | Aug 3, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31504
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method of providing a fine line adhesive bond and/or seal or gasket and/or lined channel, and in particular a fine line bonding seal, between a first (14) and a second ply (16), especially of dissimilar materials, comprises the steps of: fabricating a microscale recess in at least a first ply; lidding the first ply with a second ply such that the recess or recesses in the ply or plies form a fluidly continuous channel (12), —urging curable material into this channel so as to substantially fill the channel with curable material, and in particular urging the material via an inlet (17) into a fluidly continuous channel until it emerges from an outlet (18) remote therefrom; curing the curable material in situ. A system for implementing the method and the bonded and/or sealed and/or lined product of such method are also described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.