Thermosetting resin composition, method of manufacturing the same and circuit board
US8697237B2 · kind B2 · utility
0Cited by
8References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 29, 2013 |
| Grant date | Apr 15, 2014 |
| Priority date | — |
| Expiry date | Apr 29, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31511
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The invention relates to a thermosetting resin composition which includes a metal filler component, a fluxing component and a thermosetting resin binder. The metal filler component includes at least one of bismuth (Bi) and indium (In), and tin (Sn). The fluxing component, which at least one of a compound of structural formula (1) below and a compound of structural formula (2) below, is used.In the above formulas, R1 to R6 are each a hydrogen or alkyl group, and X is an organic group which has a lone electron pair or double bond π electrons and is capable of coordinating with a metal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.