Microelectromechanical systems (MEMS) resonators and related apparatus and methods
US8698376B2 · kind B2 · utility
9Cited by
94References
6Claims
0Family size
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Key dates
| Filing date | Nov 20, 2012 |
| Grant date | Apr 15, 2014 |
| Priority date | — |
| Expiry date | Nov 20, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H2009/241
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
Devices having piezoelectric material structures integrated with substrates are described. Fabrication techniques for forming such devices are also described. The fabrication may include bonding a piezoelectric material wafer to a substrate of a differing material. A structure, such as a resonator, may then be formed from the piezoelectric material wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.