Chip resistor and method of manufacturing the same
US8698593B2 · kind B2 · utility
2Cited by
9References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 6, 2012 |
| Grant date | Apr 15, 2014 |
| Priority date | — |
| Expiry date | Apr 6, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49082
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
There is provided a chip resistor including a ceramic substrate; a first resistance layer formed on the ceramic substrate and including a first conductive metal and a first glass; and a second resistance layer formed on the first resistance layer, including a second conductive metal and a second glass, and having a smaller content of glass than the first resistance layer, thereby obtaining relatively low resistance and a relatively small temperature coefficient of resistance (TCR).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.