Patent · US Active

System, method and computer readable medium for through silicon via structure measurement

US8699021B2 · kind B2 · utility

2Cited by

6References

17Claims

0Family size

Assignee

Industrial Technology Research Institute · TW

Inventors

Yi-Sha Ku · Hsinchu, TW
Wei-Te Hsu · New Taipei, TW

Key dates

Filing date	May 11, 2011
Grant date	Apr 15, 2014
Priority date	—
Expiry date	Aug 1, 2032

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/0002
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A system for through silicon via (TSV) structure measurement comprises a reflectometer, and a computing unit. The reflectometer emits a broadband light beam to at least a TSV structure and receives a reflection spectrum of at least a TSV structure. The computing unit is coupled with the reflectometer and determines the depth of the TSV structure in accordance with the reflection spectrum.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.