Liquid cooled electronics assembly suitable to use electrically conductive coolant
US8699225B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 28, 2012 |
| Grant date | Apr 15, 2014 |
| Priority date | — |
| Expiry date | Oct 5, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20927
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A liquid cooled power electronics assembly configured to use electrically conductive coolant to cool power electronic devices that uses dielectric plates sealed with a metallic seal around the perimeter of the dielectric plates to form a device assembly, and then forms another metallic seal between the device assembly and a housing. The configuration allows for more direct contact between the electronic device and the coolant, while protecting the electronic device from contact with potentially electrically conductive coolant. Material used to form the dielectric plates and the housing are selected to have similar coefficients of thermal expansion (CTE) so that the reliability of the seals is maximized.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.