Headphone sound-generating structure and method of assembling same
US8699740B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 22, 2011 |
| Grant date | Apr 15, 2014 |
| Priority date | — |
| Expiry date | Jun 25, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49005
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A headphone sound-generating structure includes a sound-generating module and a plurality fastening elements. The sound-generating module includes a first perforated plate, a first ring-shaped spacer, a diaphragm assembly, a second ring-shaped spacer, a second perforated plate, and a second ring-shaped mounting frame, which are sequentially superposed in a receiving space defined on an ear cup. The fastening elements are extended through third mounting holes of the second ring-shaped mounting frame and fourth mounting holes of the ear cup to thereby quickly secure the sound-generating module to the ear cup to complete a headphone sound-generating structure, which can be manufactured at lowered cost and increased good yield, and allows convenient maintenance without wasting any material. A method of assembling the headphone sound-generating structure is also introduced.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.