Placement head for a die placing assembly

US8701276B2 · kind B2 · utility

Assignee

• Zamtec Ltd · IE

Inventors

• David Burke · Chatswood, AU
• Jan Waszczuk · Sydney, AU
• Desmond Bruce Boyton · Sydney, AU
• Craig Donald Strudwicke · Sydney, AU
• Peter John Morley Sobey · Sydney, AU
• William Granger · Sydney, AU
• Jason Mark Thelander · Chatswood, AU
• Eric Patrick O'Donnell · Sydney, AU

Key dates

• Filing date: Aug 19, 2008
• Grant date: Apr 22, 2014
• Expiry date: Jun 11, 2030

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T29/53261
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

The invention provides for a placement head for a die placing assembly of an assembler for assembling dice on a carrier. The assembler has an enclosure with a support assembly for operatively supporting a wafer with dies thereon, a die picking assembly for picking dice from said wafer, a die placement assembly for placing the dies onto the carrier, a die conveyance mechanism operatively conveying the dies from the die picking and placement assemblies, and a control system controlling the assembler. The placement head includes a first translation stage mounted on the die placement assembly, said first stage operatively displaceable along a first axis relative to the die placement assembly. The placement head also includes a second translation stage mounted on the first stage, the second stage displaceable perpendicular to the first stage. The placement head further includes a third translation stage mounted on the second stage, the third stage displaceable orthogonally to the first and second stages, as well as a die placer head mounted to the third stage, the placer head shaped and dimensioned to operatively receive a die from the dice conveyance mechanism and to place the dice ont…