Induction bonding
US8701966B2 · kind B2 · utility
5Cited by
20References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 24, 2013 |
| Grant date | Apr 22, 2014 |
| Priority date | — |
| Expiry date | Jan 24, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49179
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The described embodiment relates generally to the field of inductive bonding. More specifically an inductive heater designed for use in assembling electronics is disclosed. A number of methods for shaping a magnetic field are disclosed for the purpose of completing an inductive bonding process without causing harm to unshielded adjacent electrical components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.