Retention structure for heat generating component
US8702052B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 5, 2012 |
| Grant date | Apr 22, 2014 |
| Priority date | — |
| Expiry date | Oct 7, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A retention structure for retaining a heat generating component to a heat dissipating substrate. The heat generating component has a heat transfer surface and an opposing biasing surface, and the heat dissipating substrate has opposing first and second sides. The retention structure has a generally U-shaped retention body including an elongated base having opposing ends, and legs extending from the ends of the base. Each of the legs includes a positioning slot. The substrate includes a pair of passages for receiving the legs therethrough, and a pin structure is positioned on the substrate and extends through the positioning slots in the legs to locate the base of the retention body adjacent to the biasing surface and effect a biasing of the heat transfer surface toward the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.