Mounting arrangement and method for light emitting diodes
US8702273B2 · kind B2 · utility
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20Claims
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Key dates
| Filing date | May 29, 2012 |
| Grant date | Apr 22, 2014 |
| Priority date | — |
| Expiry date | May 29, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49826
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A modular light emitting diode (LED) mounting configuration is provided including a light source module having a plurality of pre-packaged LEDs arranged in a serial array. The module includes a heat conductive body portion adapted to conduct heat generated by the LEDs to an adjacent heat sink. As a result, the LEDs are able to be operated with a higher current than normally allowed. Thus, brightness and performance of the LEDs is increased without decreasing the life expectancy of the LEDs. The LED modules can be used in a variety of illumination applications employing one or more modules.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.