Composite cutter substrate to mitigate residual stress

US8702825B2 · kind B2 · utility

Assignee

• SMITH INTERNATIONAL, INC. · US

Inventors

• Yuelin Shen · Houston, US
• Youhe Zhang · Spring, US
• Jibin Shi · Spring, US
• Yuri Burhan · Spring, US
• Gregory T. Lockwood · Pearland, US

Key dates

• Filing date: Feb 9, 2011
• Grant date: Apr 22, 2014
• Expiry date: Mar 23, 2032

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B22F2005/001
• WIPO field: Materials, metallurgy
• WIPO sector: Chemistry

Abstract

A method of forming a cutting element that includes filling at least one non-planar region on an upper surface of a carbide substrate with a diamond mixture, subjecting the substrate and the diamond mixture to high pressure high temperature sintering conditions to form a reduced-CTE substrate having polycrystalline diamond that extends a depth into the reduced-CTE substrate in an interface region, and an upper surface made of a composite surface of diamond and carbide, and attaching a polycrystalline diamond body to the composite surface of the reduced-CTE substrate is disclosed.