Method of forming a microstructure
US8703232B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 25, 2009 |
| Grant date | Apr 22, 2014 |
| Priority date | — |
| Expiry date | Oct 3, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2462
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present disclosure describes an article and a method of forming a microstructure. The method includes providing a substrate having a structured surface region comprising one or more recessed features with recessed surfaces. The structured surface region is substantially free of plateaus. The method includes disposing a fluid composition comprising a functional material and a liquid onto the structured surface region. The method includes evaporating liquid from the fluid composition. The functional material collects on the recessed surfaces such that a remainder of the structured surface region is substantially free of the functional material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.