Methods of manufacturing large-area sputtering targets by cold spray
US8703233B2 · kind B2 · utility
10Cited by
156References
27Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 27, 2012 |
| Grant date | Apr 22, 2014 |
| Priority date | — |
| Expiry date | Oct 10, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/10
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
In various embodiments, a joined sputtering target is formed by filling at least a portion of a gap between two discrete sputtering-target tiles with a gap-fill material, spray-depositing a spray material to form a partial joint, removing at least a portion of the gap-fill material, and, thereafter, spray-depositing the spray material to join the tiles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.