Method for forming a microstructure
US8703409B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 13, 2011 |
| Grant date | Apr 22, 2014 |
| Priority date | — |
| Expiry date | Dec 1, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24355
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method for forming a microstructure includes: (a) forming a photocurable layer on a substrate, the photocurable layer including at least one photocurable compound that has a photocurable functional group equivalent weight ranging from 70 to 700 g/mol; (b) covering partially the photocurable layer using a patterned mask; (c) exposing the photocurable layer through the patterned mask using a first light source so that the photocurable layer is cured at first regions which are exposed; (d) removing the patterned mask; and (e) illuminating the photocurable layer using a second light source to cure second regions of the photocurable layer which have not been cured. The first and second regions have different surface heights and provide a surface roughness for the microstructure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.