Method for manufacturing an electronic module and an electronic module

US8704359B2 · kind B2 · utility

Assignee

• GE Embedded Electronics Oy · FI

Inventors

• Risto Tuominen · Espoo, FI
• Petteri Palm · Regensburg, DE
• Antti Iihola · Helsinki, FI

Key dates

• Filing date: May 31, 2011
• Grant date: Apr 22, 2014
• Expiry date: Jun 12, 2032

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T29/4913
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

This publication discloses an electronic module and a method for manufacturing an electronic module, in which a component (6) is glued (5) to the surface of a conductive layer, from which conductive layer conductive patterns (14) are later formed. After gluing the component (6), an insulating-material layer (1), which surrounds the component (6) attached to the conductive layer, is formed on, or attached to the surface of the conductive layer. After the gluing of the component (6), feed-throughs are also made, through which electrical contacts can be made between the conductive layer and the contact zones (7) of the component. After this, conductive patterns (14) are made from the conductive layer, to the surface of which the component (6) is glued.