Sensor device and method for manufacture
US8705245B2 · kind B2 · utility
0Cited by
26References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 28, 2011 |
| Grant date | Apr 22, 2014 |
| Priority date | — |
| Expiry date | Apr 14, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24926
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A sensor device has a ceramic carrier substrate. At least two conductor tracks are arranged on the carrier substrate. The sensor device has at least one ceramic component that is in the form of a chip and is connected to the conductor tracks in an electrically conductive manner. The at least one ceramic component is mechanically connected to the conductor tracks by means of a screen printing paste which has been burnt in.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.