Method for manufacture of a fuse for a printed circuit board
US8705249B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 1, 2010 |
| Grant date | Apr 22, 2014 |
| Priority date | — |
| Expiry date | Dec 7, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01H2085/0283
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Some invention embodiments relate to a method for forming a fuse which electrically connects two metal surfaces (2) that are arranged on a printed circuit board (4) next to each other and spaced apart from each other. It is provided according to the invention that the two metal surfaces (2) are each partially covered with a protective coating (5), wherein a partial region forming a contact region (2a) remains uncovered, liquid soft solder material (1) which bridges the gap between the two metal surfaces (2) is applied onto the two uncovered partial regions (2a), and the protective coating (5) in a surrounding area of the solder material (1) is removed after the soft solder material (1) has solidified, in order to form receiving regions (2b) which are wetted by the solder material (1) when the latter fuses, with the result that the solder material (1) flows off from a printed circuit board region (3) between the two metal surfaces (2) and the electrical contact formed by the solder material (1) is interrupted. Furthermore, other invention embodiments relate to a printed circuit board with such a fuse.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.