Single layer PCB microfluidics
US8707545B2 · kind B2 · utility
0Cited by
5References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 26, 2013 |
| Grant date | Apr 29, 2014 |
| Priority date | — |
| Expiry date | Sep 26, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T436/2575
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit board structure is coated with an encapsulant within which microfluidic channels have been formed. The microfluidic channels are formed by soldering fluidic connections to metal traces on a surface of the printed circuit board structure prior to encapsulation. The metal traces are removed by etching after encapsulation to form microchannels within the encapsulant.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.