Assembling an electrode device
US8709194B1 · kind B1 · utility
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43References
8Claims
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Assignee
Inventors
Key dates
| Filing date | Feb 25, 2013 |
| Grant date | Apr 29, 2014 |
| Priority date | — |
| Expiry date | Feb 25, 2033 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB32B2457/208
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method of assembling an electronic device includes providing a transparent conductive polymer layer coated over a first support followed by pattern-wise forming a transparent mask with at least one opening over the conductive polymer. The masked conductive polymer is subjected to treatment through the opening that changes conductivity of the conductive polymer by at least one order of magnitude in areas not covered by the mask to form a first electronic component. The first electronic component having the mask is secured to a second electronic component, thereby forming the electronic device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.