Method of making electronic component and heat conductive member and method of mounting heat conductive member for electronic component
US8709197B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 6, 2008 |
| Grant date | Apr 29, 2014 |
| Priority date | — |
| Expiry date | May 31, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1089
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A bonding material is placed on an electronic component. a heat conductive member is superposed on the surface of the bonding material so that a thermosetting adhesive is interposed between the heat conductive member and a substrate. The thermosetting adhesive is then cured at a temperature lower than the melting point of the bonding material. The bonding material melts after the thermosetting adhesive has cured. While a distance is maintained between the heat conductive member and the substrate, the thermosetting adhesive is cured. The heat conductive member is thus reliably prevented from a downward movement regardless of the melting of the bonding material. A space is maintained between the heat conductive member and the electronic component. The cured bonding material is reliably prevented from suffering from a reduction in the thickness.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.