Liquid low temperature injection molding process
US8709325B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 21, 2005 |
| Grant date | Apr 29, 2014 |
| Priority date | — |
| Expiry date | Nov 13, 2027 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29K2023/0683
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
The molding method of the invention is a low-temperature, liquid-phase, injection molding process using an externally heated mold. This molding process is ideally suited for production of limited quantities of molded parts, as comparatively low cost molds can be used. The molding composition used in the invention is a mixture of a carrier and binder component and a powdered polyethylene component. The carrier and binder component can be a very low density polyethylene, petroleum jelly, hydrocarbon waxes, liquid hydrocarbon oils, or mixtures thereof. The powdered polyethylene component is finely subdivided polyethylene, preferably ultra high molecular weight, having a low melt index, at least no greater than 30. The carrier and binder component is used in sufficient quantity to provide a thixotropic mixture with a consistency of toothpaste, typically having a stirred viscosity up to 30,000 centipoise at the injection temperature of the molding process. Since the process utilizes a mold which is externally heated, it can be controlled to provide minimal heating of the core of the part, thereby permitting one to incorporate components within the part without damage to temperature sens…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.