System and method for removing oxide from a sensor clip assembly
US8709949B2 · kind B2 · utility
4Cited by
9References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 13, 2011 |
| Grant date | Apr 29, 2014 |
| Priority date | — |
| Expiry date | Dec 22, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/81011
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
According to embodiments of the present disclosure, a method for removing oxide includes placing a sensor chip assembly having an oxide layer formed on a portion thereof within an enclosed and controlled environment. The portion of the sensor chip assembly is exposed to a reactive gas and a UV light to result in a substantial removal of the oxide layer formed on the portion of the sensor chip assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.