LED package chip classification system
US8710387B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 5, 2011 |
| Grant date | Apr 29, 2014 |
| Priority date | — |
| Expiry date | Jun 21, 2032 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2635
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An LED package chip classification system includes a rotation unit for transporting a plurality of LED package chips, a chip test unit, and a chip classification unit. The rotation unit includes a rotary turntable, a plurality of receiving portions formed on the rotary turntable, and a plurality of suction-exhaust dual-purpose openings respectively disposed in the receiving portions. Each LED package chip has a positive electrode pad and a negative electrode pad disposed on the bottom side thereof. The chip test unit includes a chip test module adjacent to the rotation unit for testing each LED package chip. The chip classification unit includes a plurality of chip classification modules adjacent to the rotation unit for classifying the LED package chips. Therefore, the LED package chips can be classified by matching the rotation unit, the chip test unit, and the chip classification unit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.