Method of bonding metallic members, and metallic bonded body
US8710393B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Oct 28, 2010 |
| Grant date | Apr 29, 2014 |
| Priority date | — |
| Expiry date | Mar 30, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12347
- WIPO fieldMechanical elements
- WIPO sectorMechanical engineering
Abstract
By respectively abutting first and second outer diameter sections of a second metallic member against first and second inner diameter sections of a first metallic member, and energizing the first metallic member and the second metallic member using a pair of electrodes while pressurizing both metallic members in an axial direction thereof, a first junction where the first inner diameter section and the first outer diameter section are bonded and a second junction where the second inner diameter section and the second outer diameter section are bonded are formed between both metallic members, and a gap in which the metals do not come into contact with each other is formed between both junctions over a predetermined axial length. Accordingly, a high joint strength can be secured using less energy for bonding.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.