Method and apparatus for laser strip splicing
US8710398B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 17, 2011 |
| Grant date | Apr 29, 2014 |
| Priority date | — |
| Expiry date | May 15, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/5183
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A splicing apparatus for joining a trailing end of a downstream metal strip to the leading end of an upstream metal strip includes a base having a working surface, a cover assembly operatively connected to the base and movable between an open position and a closed position, a fixed platen fixedly secured to the working surface, a moving platen slidably connected to the working surface, and a laser device for both cutting said downstream and upstream metal strips and for welding said metal strips together, the laser device including a laser source and a laser head in communication with the laser source, the laser head being connected to said cover assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.