Radiation-emitting semiconductor chip and method for producing a radiation-emitting semiconductor chip

US8710537B2 · kind B2 · utility

Assignee

• OSRAM Opto Semiconductors GmbH · DE

Inventors

• Karl Engl · Niedergebraching, DE
• Berthold Hahn · Hemau, DE
• Klaus Streubel · Hemau, DE
• Markus Klein · Glückstadt, DE

Key dates

• Filing date: Jun 25, 2009
• Grant date: Apr 29, 2014
• Expiry date: Jul 15, 2029

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/0002

Abstract

A radiation-emitting semiconductor chip includes: a carrier and a semiconductor body with a semiconductor layer sequence including an active region that generates radiation, a first semiconductor layer and a second semiconductor layer; wherein the active region is arranged between the first semiconductor layer and the second semiconductor layer; the first semiconductor layer is arranged on a side of the active region which faces away from the carrier; the semiconductor body comprises at least one recess which extends through the active region; the first semiconductor layer is electrically conductively connected to a first connection layer extending in the recess from the first semiconductor layer in a direction of the carrier; and the first connection layer is electrically connected to the second semiconductor layer via a protective diode.