Method and apparatus for connecting signal lines of multiple layers to certain contacts while preventing connections with other contacts
US8710553B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 3, 2013 |
| Grant date | Apr 29, 2014 |
| Priority date | — |
| Expiry date | Jul 3, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10B12/48
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit includes a substrate. The substrate includes diffusion lines. The diffusion lines include impurities diffused into the substrate. A signal line layer includes first signal lines. A first metal layer includes second signal lines. The second signal lines include a first metallic material. A second metal layer includes third signal lines. The third signal lines include a second metallic material. First contacts connect the diffusion lines to (i) a first set of the second signal lines, or (ii) a first set of the third signal lines. Second contacts connect a first set of the first signal lines to a second set of the third signal lines. Each signal line in a first set of the second signal lines includes first portions and second portions. The first portions extend towards and are not connected to the second contacts. The first portions are not parallel to the second portions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.